| abstract |
Disclosed are a polynuclear polyhydric phenol represented by the following general formula [I]: <IMAGE> [I] <IMAGE> wherein R1 and R2 stand for a hydrogen atom or a lower alkyl group, R3 stands for a hydrogen atom, an alkyl group, an aryl group or a halogen atom, and n is an integer of from 0 to 10, and a polyepoxy compound consisting of a polyglycidyl ether of this polynuclear polyhydric ether. When this polyepoxy compound is combined with a curing agent, a curable epoxy resin composition excellent in the heat resistance characteristics is provided. |