| abstract |
An epoxy resin composition having excellent handling properties, solvent resistance and heat resistance and particularly excellent low-temperature curability is provided which comprises (A) a polyfunctional epoxy resin having an epoxy equivalent of 160 to 2,000 obtained by reacting an epoxy resin having an epoxy equivalent of 100 to 800 with a molecular weight increasing agent containing 2.1 to 10 functional groups (phenolic hydroxyl groups) on an average per molecule and (B) a curing agent for the epoxy resin) as essential ingredients. |