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filingDate 1984-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1986-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be0b1891199b4a899e9cb88b17c364a4
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publicationDate 1986-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4607193-A
titleOfInvention Textured carbon surfaces on copper by sputtering
abstract A very thin layer of highly textured carbon is applied to a copper surface by a triode sputtering process. A carbon target 10 and a copper substrate 12 are simultaneously exposed to an argon plasma 14 in a vacuum chamber. n The resulting carbon surface is characterized by a dense, random array of needle-like spires or peaks which extend perpendicularly from the copper surface. The coated copper is especially useful for electrode plates in multistage depressed collectors.
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