| abstract |
An organic solvent-soluble photosensitive polyamide resin usable for producing photoset resin product having excellent heat resistance and electrical and mechanical properties, comprising a polycondensation product of an aromatic dicarboxylic acid component with an aromatic diamine component consisting of 10 to 100 molar % of a photosensitive diamine compound of the formula (I) and 10 to 90 molar % of a non-photosensitive diamine compound of the formula (II), H2N-R1-NH2 (I) H2N-R2-NH2 (II) wherein R1 represents an aromatic divalent residue having a photosensitive radical and R2 represents an armoatic divalent residue having no photosensitive radical. |