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filingDate 1984-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1986-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4588768-A
titleOfInvention Thermally conductive heat curable organopolysiloxane compositions
abstract This invention relates to thermally conductive heat curable organopolysiloxane compositions containing from 30 to 95 percent by weight of filler based on the weight of the composition of which at least 10 percent by weight of the filler is silicon nitride particles.
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