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filingDate 1983-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1985-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87abf7fad3be68eebbf4a9016d404e53
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publicationDate 1985-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4540621-A
titleOfInvention Dielectric substrates comprising cordierite and method of forming the same
abstract A method for forming a substrate for electronic applications having a dielectric constant of less than 6 is disclosed. The method comprises admixing crystalline cordierite particles having a size of 0.1--10 microns with a binder and solvent, casting the same into a sheet, drying the cast sheet into a self-supporting green sheet and then heating the green sheet to burn out the binder and to sinter the particles together. A metallization pattern is deposited on the green sheet after the casting but before the heating, the metallization pattern being molybdenum or tungsten. The cordierite has a defined coefficient of thermal expansion. A dielectric substrate for mounting of integrated circuit devices thereon is also disclosed.
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