| abstract |
There is provided a handling system for IC devices having a guide stage comprising a bank portion in which both sides of a IC device to be tested are held at a position other than a portion where terminals of the IC device project and a vacuum suction pore which suctorially sticks to the underside of the IC device at the midpoint of the bank portion. n There is also provided a handling system for IC devices wherein multiple bank portions are provided on the stage, one half of which is used for carrying IC devices and the remaining half of which is used for discharging IC devices. |