abstract |
The present invention is directed to a heat-curable composition comprising: (1) a polyepoxide, (2) at least one unsaturated monomer (e.g., esters of ethylenically unsaturated monocarboxylic acids), (3) an acid anhydride, (4) at least one epoxy curing accelerator (onium salts such as ethyl triphenyl phosphonium iodide) and (5) a free radical initiator. |