| abstract |
Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises (a) exposing imagewise said element, (b) applying particulate conductive metal, e.g., nickel, copper, to the unexposed image areas, optionally (c) heating the metal bearing areas, then (d) removing excess metal particles, optionally (e) fixing the particulate metal to the layer by heating, exposing to UV light or mechanical embedding, and (f) plating electrolessly or soldering the metal containing areas. The process can be operated continuously to prepare single and double layer flexible printed circuits, membrane switches, etc. |