| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0317
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-043 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21C37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| filingDate |
1983-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1984-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6518dde1fd99dd42befc9b57e1f682f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6879e170cb0d858fc3b022a481ae97d |
| publicationDate |
1984-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4452664-A |
| titleOfInvention |
Method for predetermining peel strength at copper/aluminum interface |
| abstract |
A low temperature (about 0° C. to about 100° C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6248401-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6136121-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4791248-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8137575-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5653850-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5709957-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5322975-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5843276-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5532447-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009200263-A1 |
| priorityDate |
1983-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |