| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5202091df9de019fc995f2d266f9ecc2 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
1982-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1984-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b26e05708be3eff1251d5146c8e211b8 |
| publicationDate |
1984-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4452650-A |
| titleOfInvention |
Copper and copper alloy coating |
| abstract |
Copper or copper alloy sheet or foil displaying excellent solderability and high resistance to tarnish is prepared by the provision over its surface of a coating containing a copper salt of an organophosphonic acid. To form the coating, the sheet or foil is immersed for a short time in an aqueous solution containing a phosphonic acid, rinsed and dried, the treatment being combined with or preceded by oxidation of the sheet surface. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008131709-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5573845-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018142372-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5454876-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5122858-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019360115-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5300158-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5145722-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005268991-A1 |
| priorityDate |
1980-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |