| abstract |
Thixotropic epoxide resin compositions, suitable for use as laminating resins, paints and lacquers, impregnating and casting resins, potting, insulating, and caulking compounds, sealants, and adhesives, are prepared by adding to an epoxide resin (a) a base having a basic strength, pKb, of 9 or less, (b) an organo-orthosilicate of formula (RO)4Si where R represents an alkyl group, optionally substituted by one or more halogen atoms or alkoxy groups, an aryl or aralkyl group which may be substituted by one or more halogen atoms, alkyl groups, or alkoxy groups, or a heterocyclylalkyl group, and (c) water. Such compositions may further contain (d) a curing agent for epoxide resins, which agent may be the same as, or different from, the base (a). |