http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4412884-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F22-40
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12
filingDate 1982-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1983-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86cf511d418124a8a681a13b98ccc0aa
publicationDate 1983-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4412884-A
titleOfInvention Adhesive bonding method employing diene bis-imide polymers
abstract A moisture resistant polyimide adhesive is disclosed comprising a polymer having repeating units of the formula: <IMAGE> where n is equal to about 8 to about 20. The improved moisture resistance of the polymers according to the present invention is indicated by a moisture pick-up of less than about 0.6% by weight after 24 hour immersion in room temperature water. The polymer also exhibits a tensile strength greater than about 1800 psi (1.24x107 NT/M2). In addition to their improved adhesive and moisture resistant properties, the polymers according to the present invention exhibited such properties with cure times of less than about one hour at temperatures up to about 320 DEG C.
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priorityDate 1981-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 47.