| abstract |
From 0.1 to 3.5% by weight of beryllium oxide powder, calculated as beryllium, is added to silicon carbide powder containing up to 0.1% by weight of aluminum, up to 0.1% by weight of boron and up to 0.4% by weight of free carbon, and the mixed powder is pressure-molded. The resulting molded article is heated to a temperature of 1,850 DEG C. to 2,500 DEG C. till there is obtained a sintered body having at least 90% relative density of silicon carbide. Thus, the sintered body having thermal conductivity of at least 0.4 cal/cm.sec. DEG C. at 25 DEG C., electrical resistivity of at least 107 Ohm.cm at 25 DEG C. and coefficient of thermal expansion of 3.3 DIFFERENCE 4x10-6/ DEG C. at 25 DEG C. to 300 DEG C. can be obtained. |