| abstract |
An epoxy resin composition comprising (1) about 20 to about 80% by weight of a solid epoxy resin, and (2) about 80 to about 20% by weight of a solid resole-type phenolic resin having a softening point of about 70 DEG to about 90 DEG C., a gel time at 150 DEG C. of at least about 80 seconds and a methylol index of about 25 to about 45, said phenolic resin being a condensation product of 1 mol of a phenol with 1 to about 4 mols of an aldehyde. |