| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d669af06cb2abbcd6823699582a97002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H1-0231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C5-06 |
| filingDate |
1980-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1982-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f42c96650746bc3e51757faabf445b7 |
| publicationDate |
1982-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4344794-A |
| titleOfInvention |
Solder alloy for the direct soldering of oxide containing silver catalyst on catalyst carrier |
| abstract |
For soldering non-noble metal containing silver contacts on contact carriers, solders are needed which permit a direct soldering without production of an oxide free intermediae layer. This is attained with solders that consist of a silver-copper alloy with cadmium and/or tin and/or indium whereby the composition must be so selected that the liquidus temperature does not exceed 750 DEG C. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4972565-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5120498-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6430794-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4456662-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5520323-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5417363-A |
| priorityDate |
1979-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |