| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 |
| filingDate |
1981-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1982-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d481501149b1e906994a987a3a4cfa3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b329c6fc81c6b01c19579bccfe5ba7d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45b97e3836faded783025f056247d6c7 |
| publicationDate |
1982-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4328150-A |
| titleOfInvention |
Curable epoxy resin compositions |
| abstract |
The invention provides a novel epoxy-based curable resin composition suitable for encapsulation of electronic devices such as transistors, ICs, LSIs and the like. The composition comprises an epoxy compound, a novolac-type phenolic resin as the curing agent, an organophosphine compound such as triphenylphosphine and trilaurylphosphine as a curing accelerator and an inorganic filler. The advantages obtained by the combined use of the novolac-type phenolic resin and the organophosphine compound are very specific and the resin composition is imparted with remarkable flowability in molding and stability in storage in addition to the excellent electric properties at high temperatures and anti-moisture resistance of the cured shaped articles molded therefrom. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011041340-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8779034-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6645631-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6548576-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0120981-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5180794-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009031146-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6168872-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4617584-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0142359-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4826896-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4888634-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4710796-A |
| priorityDate |
1980-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |