| abstract |
An electric recording material comprising (A) a semiconductive resin layer comprising a resin matrix and a conductivity-imparting agent dispersed therein and having a surface resistance of more than 1 ohm to less than 105 ohms, (B) a metal-containing resin layer comprising a resin matrix and 5 to 60% by volume of a metal powder dispersed therein and having a surface resistance of 105 to 1016 ohms, said metal-containing layer being laminated to one surface of said semiconductive resin layer (A), (C) an electrically conductive covering layer having a surface resistance not exceeding 104 ohms and being lower than that of the semiconductive resin layer (A), said covering layer being laminated to the other surface of said resin layer (A), and (D) optionally, a protective covering resin layer having a higher surface resistance than that of said covering layer (C) and a thickness of not more than 10 microns, said protective covering layer being laminated to said conductive covering layer (C); and a method for electric recording using said material. The use of said material permits recording at low voltages. |