| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D207-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D207-452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 |
| filingDate |
1979-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1981-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_832e036bba66b486bdae0318ff14e431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98678deb7fd08d57628a6fe4ba20cb59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46358845e20712c7c92ece89c9044354 |
| publicationDate |
1981-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4278780-A |
| titleOfInvention |
Thermosetting resin composition comprising epoxy compound and reaction product of unsaturated dicarboxylic acid anhydride and excess diamine |
| abstract |
A thermosetting resin composition suitable for use as a molding material comprising (a) a reaction product mixture obtained by preferably reacting 1 mole of a dicarboxylic acid anhydride having ethylenic carbon-carbon double bond such as maleic anhydride with 2-20 moles of a diamine such as 4,4'-diaminodiphenylmethane in a molten state and (b) an epoxy compound having more than one 1,2-epoxy group on the average gives a cured product excellent in heat resistance, etc., when cured with heating at a temperature of 150 DEG to 200 DEG C. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6316074-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6221295-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4728742-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6493914-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6485660-B1 |
| priorityDate |
1978-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |