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publicationDate 1981-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4268848-A
titleOfInvention Preferred device orientation on integrated circuits for better matching under mechanical stress
abstract A system including in combination matched semiconductor elements in a monolithic integrated circuit together with an inexpensive encapsulation. Good electrical matching of individual components in an integrated circuit is achieved by predetermined placement and orientation of the matched components on the semiconductor element. The match is maintained through the assembly steps comprising mounting of the semiconductor element on a metallic support and subsequent encapsulation of the assembly. Best matching for devices located substantially in a {111} plane is achieved by symmetrical placement about a <211> direction.
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