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filingDate 1978-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1981-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1981-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4262165-A
titleOfInvention Packaging structure for semiconductor IC chip
abstract A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the binding agent is recessed with respect to the outer surface of the packaging or sealing members.
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