| abstract |
Disclosed is a hot-melt adhesive composition comprising a polyester amide of from about 50 to about 85 mole % terephthalic acid, from about 15 to about 50 mole % of an aliphatic dicarboxylic acid having from 4 to 12 carbon atoms, about 60 to about 90 mole % of 1,6-hexanediol, and from about 10 to about 40 mole % 1,6-hexanediamine. The polyester amide has a glass transition temperature of from about -15° to about 15° C., a melting point of about 70° to about 140° C., and is useful as a fabric adhesive. |