| abstract |
A composition, which is suitable for use as an adhesive, is made by mixing: (A) 1 part of an adduct reaction product consisting of a solid epoxy resin and a stoichiometric excess of an aliphatic amine; with (B) about 1 part to about 6 parts of a reactive solid epoxy resin powder having an average particle size of from about 10 microns to about 420 microns, the mixture being capable of melting at temperatures of over about 60 DEG C; wherein the epoxy of (B) remains unreacted until melting. |