Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01077 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-248 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
filingDate |
1977-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1978-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f0cefbb924fd3255471afd1b6593b0f |
publicationDate |
1978-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-4081901-A |
titleOfInvention |
Method of making a ternary barrier structure for conductive electrodes |
abstract |
A ternary barrier structure and method for forming the structure to be used on a conductive electrode. In electronic structures, dielectric substrates are used which have a plurality of connecting conductive areas which are wettable by solder. The region surrounding these connecting conductive areas are not wettable by solder. Barrier structures are used to prevent the flow of the solder while the solder is liquid during the manufacture of these electronic products. The present barrier structure covers at least a portion of one of these connecting conductive electrodes wherein the electrode is composed predominately of silver and a lesser quantity of one or more of the platinum metals. The barrier structure includes a gold bearing, non-wettable by solder, glaseous layer over a portion of the electrode. The portion of the conductive electrode under and adjacent to the barrier glaseous layer contains a gold-silver alloy which is produced during the formation of the barrier structure by diffusion of the gold from the glaseous layer into the conductive electrode. A particularly corrosion resistant barrier structure and conductive electrode combination is thereby produced at this rather critical point in the microminiature circuit structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5962151-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5924623-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5345361-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5361966-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0191434-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0191434-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5152451-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5532612-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5126818-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10756298-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5102969-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4923583-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5847326-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5347423-A |
priorityDate |
1974-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |