| abstract |
Molding composition comprising from 10 to 50 wt.% of the polycondensation product of an alkylene glycol or a mixture of the latter with up to 20 wt.% of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof, with an ethylenically unsaturated dicarboxylic acid and a saturated dicaboxylic acid, having a melting point of at least 60° C, an acid value of less than 50 and a Gardner viscosity from Y to Z 3 , from 0.2 to 2 wt.% of organic peroxide with a decomposition temperature above 70° C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields. |