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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
filingDate 1976-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1977-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50ba782dd7527c4d7d573ab1b81d6df4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_675b21f2dfa3c73a2ae6289eab54f920
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publicationDate 1977-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4059451-A
titleOfInvention Electroless copper plating solution
abstract An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.
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