| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate |
1975-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1977-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bb38cd84c163157b87490cdd0ae591f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1141ce0b3efa3e5ac1627011af90bd20 |
| publicationDate |
1977-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4007037-A |
| titleOfInvention |
Composition and method for chemically etching copper elements |
| abstract |
This invention resides in compositions and methods for chemically etching copper elements. The etching solution of this invention is composed of materials which can be easily regenerated and the copper metal etched from the copper element easily recovered. The etching solution is also of a type that is substantially self-sustaining. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5049234-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003102226-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003080092-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6773573-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4352716-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6838009-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4497687-A |
| priorityDate |
1975-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |