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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-70
filingDate 1975-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1976-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93b17a20827b54e04aa5112490ab3360
publicationDate 1976-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-3997411-A
titleOfInvention Method for the production of a thin film electric circuit
abstract Method for the production of an electric thin-film circuit having a conductor path and at least one capacitor and/or one resistor, and comprising a substrate base member and the forming of a first tantalum-aluminum-alloy layer thereupon and etching the tantalum-aluminum-alloy layer to form the outline of the conductor path. A second tantalum-aluminum alloy layer is then laid on the first tantalum-aluminum-alloy layer and has a tantalum content of approximately 2 through 20 atomic percent at least in the area of the capacitor. An oxidation layer is formed upon the second tantalum-aluminum-alloy layer to constitute the capacitor dielectric. The conductor paths and the opposite capacitor electrode are formed of a conductive layer such as a nickel-chromium-gold layer which is applied as a surface layer and serves as a capacitor electrode and as conductor paths.
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priorityDate 1973-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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