| abstract |
An electrically conductive resinous composition of a copper flake, the surface of which has been cleaned by removing therefrom impurities and/or oxides, a resinous binder, an amount of copper flake in said resinous composition being from 25 to 70 percent, the impurities in said copper flake being less than 7000 ppm, said resinous composition being cured with a curative comprising a polyamide or an anhydride, or mixtures thereof; these compositions are suitable for uses such as heating panels or conformable heating shapes. |