| abstract |
A composition with high thermal stability possessing superior resistance to mold and die deposits comprises (A) an oxymethylene homopolymer or copolymer and (B) 0.01 to 10% by weight of an amide oligomer having a molecular weight of 800 to 10,000 and wherein the active ends (based upon either amine or acid terminal groups) of the oligomer constitute no more than 0.02 mole % of the formaldehyde segments in the oxymethylene polymer. |