http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3950570-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C5-58
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-72
filingDate 1974-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1976-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66c4eeb1ef8d96ada0eeb5be783a9307
publicationDate 1976-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-3950570-A
titleOfInvention Method of depositing a metal on a surface
abstract A method of depositing a metal on a surface of a substrate is disclosed. A surface of the substrate is sensitized with a photosensitive sensitizer comprising a photosensitive species of (1) an element selected from Ni, Mn, U, Mo and W, or (2) a combination of elements comprising Pd and an element selected from In and Ce. The sensitized surface is exposed to a suitable source of radiation, e.g., ultraviolet radiation, to delineate a surface pattern, corresponding to a desired metal pattern, containing a species of at least one selected element which is either (1) capable of reducing an activation metal ion to catalytic activating metal or (2) capable of being reduced to a catalytic activating metal such as catalytic palladium. The ultraviolet radiation-delineated surface pattern is then exposed or treated with a solution comprising an activating metal ion to reduce and deposit thereon an activating metal. The deposited activating metal pattern is then exposed, as by immersion, to a suitable electroless metal deposition solution wherein an electroless metal is catalytically reduced on the activating metal pattern. However, where Pd-In, Pd-Ce sensitizers are employed, exposure to an activating metal ion containing solution is unnecessary and the delineated surface pattern is directly exposed to the electroless metal deposition solution.
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priorityDate 1974-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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