| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd8dff0cc6d024e095d5decaf9202f49 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-482
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 |
| filingDate |
1974-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1976-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3836318b1bf00a67fc45f5d101de1bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7dfb6421bfbc7bfb3dbe452f8dc2766 |
| publicationDate |
1976-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-3947952-A |
| titleOfInvention |
Method of encapsulating beam lead semiconductor devices |
| abstract |
Plastic encapsulation in the form of a thin film of silicone resin is provided on the active surface of beam lead semiconductor chips by a multistep process. An etchable organic film, for example, of silicone resin, is applied to the chips while they are still in wafer form. A mask is formed on top of the resin having a pattern conforming to the underlying semiconductor chips. The exposed resin overlying the intervening beam lead grid portion is then dissolved, after which the mask is removed. The final step is the standard wafer separation which leaves each semiconductor chip with a thin silicone resin coating over the active surface thereof. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6107179-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7232694-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8348503-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0961319-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0961319-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4384917-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6182342-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6652665-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4769108-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007235731-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4089704-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006071227-A1 |
| priorityDate |
1970-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |