| abstract |
A method for joining microminiature components to a carrying structure wherein the height of the electrical connecting structures are adjusted during the joining process. The height of the electrical connecting structures may either be adjusted during the original joining of the component to the carrying structure or it may be done in a two step solder reflow process. In the two step process the component is first joined to the carrying structure and then an additional height is given to the electrical connecting structures which improves the lifetime of the joining terminals. In each of the alternatives, a bridge together with a vaporizable fluid which wets both the bridge and a surface of the component opposite to the surface which carries the connecting structure. At the temperature of melting of the material used in the connecting structure, the fluid evaporates and surface tension pulls the component closer to the bridge which in turn elongates or increases the height of the electrical connecting structures between the carrying structure and the component. |