| abstract |
A method of sealing a metal lid on a metal peripheral wall portion of a base part of an electrical device envelope, for example an integrated circuit envelope, by pressure bonding via an intermediate malleable metal layer, for example a metal foil, at a temperature below the melting point of the layer and below the temperature at which a liquid phase would form, at a pressure of between 1 and 5 tons per square inch, and for a period not exceeding 30 seconds. |