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filingDate 1973-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1975-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1975-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-3869563-A
titleOfInvention Encapsulation housing for electronic circuit boards or the like and method of encapsulating
abstract A control device assembled on a circuit board is suitably encapsulated within a protective housing on a multiple unit basis especially suited for automation. A plurality of housings are arranged in an upright, side-by-side relation so that the associated circuit board may be inserted from a vertical direction and correctly positioned within the housing by a pair of guide rails and the action of gravity. The housings may then be suitably encapsulated utilizing a continuous and uninterrupted flow of encapsulating material. The housing itself is fabricated of a non-metallic, thermosetting material unaffected during subsequent operation in elevated ambient temperatures. The housing further includes a laterally extending lip or ledge which overlies a top portion of the next adjacent housing during assembly and encapsulation. Mounting holes are provided of a configuration to permit a wide variety of mounting locations.
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Total number of triples: 55.