| abstract |
SEMICONDUCTOR STRUCTURE HAVING A SEMICONDUCTOR BODY WITH A PLANAR SURFACE AND WITH METALLIC CONTACT PADS FORMED OVER THE SURFACE. A LAYER OF INSULATING MATERIAL IS FORMED OVER THE CONTACT PADS. BUMPS OF PILLARS ARE FORMED WHICH EXTEND THROUGH THE LAYER OF INSULATING MATERIAL AND ARE BONDED TO THE CONTACT PADS. THE BUMPS OR PILLARS ARE FORMED OF A RELATIVELY IN THE METHOD, A SEMICONDUCTOR BODY IS PROVIDED HAVING A TILE LAYER AND HAS A MUSHROOM-SHAPED CONFIGURATION. GOLD-TIN LAYERS ARE CARRIED BY THE BASE AND FORM A GOLD-TIN SYSTEM SO THAT THE BUMPS OR PILLARS CAN BE READILY BONDED TO THE LEAD FRAMES. IN THE METHOD, A SEMICONDUCTOR BODY IS PROVIDED HAVING A PLANAR SURFACE AND HAVING METALLIC CONTACT PADS FORMED OVER THE SURFACE. AN INSULATING LAYER IS FORMED OVER THE CONTACT PADS. OPENINGS ARE FORMED IN THE INSULATING LAYER. BUMPS OR PILLARS ARE FORMED WHICH EXTEND THROUGH THE OPENINGS IN THE INSULATING MATERIAL AND MAKE CONTACT WITH AND ARE SECURED TO THE PADS. THE BUMPS OR POLLARS ARE FORMED BY FIRST FORMING A RELATIVELY THICK ALUMINUM LAYER MAKING CONTACT WITH THE PADS AND THEN FORMING BASES WHICH ARE SECURED TO THE RELATIVELY THICK ALUMINUM LAYERS. GOLD-TIN LAYERS ARE FORMED ON THE BASES TO PROVIDE A GOLD-TIN SYSTEM. DURING THE FORMATION OF THE BASE AND THE GOLD-TIN LAYERS, A LWYER OF PHOTORESIST IS PROVIDED SO THAT THE BUMPS OR PILLARS ASSUME A MUSHROOM-SHAPED CONFIGURATION. |