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filingDate 1972-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1973-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1973-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-3775579-A
titleOfInvention Method and apparatus for repairing printed circuits
abstract A method and apparatus for repairing an open or void in a printed circuit line on a printed circuit board wherein the board is positioned with the open underneath a bonding head and metallic ribbon material is positioned over the open, thermal compression bonded to the circuit line on one side of the open, cut to length, and then thermal compression bonded to the circuit line on the other side of the open.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6328196-B1
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Total number of triples: 44.