| abstract |
A method of etching copper, or its alloys, with an acidic aqueous etching solution containing peroxysulfate and containing an additive which is an azole of the following structures: WHEREIN X, X'' and X'''' which may be the same or different represent any one of hydrogen, amino group, aminoalkyl group having one to three carbon atoms, and alkyl group having one to three carbon atoms; and, if required, one or more halides as a secondary component. The use of such etching solution results in an accelerated etching rate. |