| abstract |
Microcircuits are encapsulated in a hermetic plastic package by enclosing the ends of conductive leads in an open cavity arranged to house the microcircuit and defined by an inner casing, then positioning a microcircuit in the open cavity and electrically connecting the ends of the conductive leads to the microcircuit, thereafter, covering the open cavity and defining a closed cavity about the microcircuit, and then completely encapsulating the inner casing and adjacent portions of the conductive leads with an outer plastic molded casing. |