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filingDate 1971-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1973-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1973-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-3717543-A
titleOfInvention Laminations of polyimide films to like films and/or to metal foils
abstract A high temperature polyimide film - metal foil laminate and the process for making same is disclosed. The laminate webs are jointed together by an acrylic-epoxy resin adhesive that has been found to be very resistant to delamination of the webs during high temperature applications. The epoxy component of the adhesive is of the low molecular weight epichlorohydrin bisphenol A type having an epoxide equivalent weight of less than 550. The epoxy component is present in a substantial excess in relation to the acrylic component of the adhesive.
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