| abstract |
There is disclosed a novel brightener composition for aqueous, acid copper electroplating baths comprising a combination of an ethylene oxide adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol; disodium 2,7-dihydroxy-4,5-dithiaoctane-1,8-disulfonate monohydrate; and, 2-mercaptopyridine. The use of this brightener composition if found to provide bright, leveled ductile copper deposits from an acid copper electrolyte. |