| abstract |
A backup plate having a low thermal coefficient of expansion is loosely interposed between a terminal member of a device housing and a semiconductive element container therein. A thin protective layer is interposed between the backup plate and semiconductive element and overlies a surface of the element adjacent a diffused junction. A resilient annular junction passivant ring centers the semiconductive element within the housing, protects the semiconductive element against laterally transmitted mechanical shocks, and locates the backup plate. |