| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0285 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22 |
| filingDate |
1970-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1972-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bec2f80ff2ad77c110215ab33f90ed6 |
| publicationDate |
1972-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-3645855-A |
| titleOfInvention |
Ultrasonic repair plating of microscopic interconnections |
| abstract |
Plating equipment for special applications includes a point tipped ultrasonically agitated bonding tool adapted for electroplating. In the application process the tool receives continuous plating current and intermittent side-to-side ultrasonic agitation. In conjunction with commercial dry film photoresist masks and brush plating solutions the equipment is used to construct microscopic spot plating deposits. The equipment and method are especially useful for customized repair/rework or interconnection elements (vias) in printed circuit devices as a supplement to the basic mass manufacture process. Spot deposits made by this method are formed rapidly, well-adhered and comparable in overall quality to deposits produced on a mass manufacturing scale by conventional immersion plating techniques. Plating current and tool tip diameter critically affect plating quality. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6146516-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4919971-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015191844-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6656541-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9303328-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4994154-A |
| priorityDate |
1970-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |