| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3af3390937c06df72b00e23a42cf63ef |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
1968-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1971-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_665a1a811242f82d3678455b79a383f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9bc6d1c4e0b6c77b915df2f41b8c418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e59d4f68e74df607db514f2fbb24e8ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b4207c852c3c63530f8ae107f735418 |
| publicationDate |
1971-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-3615735-A |
| titleOfInvention |
Electroless copper plating |
| abstract |
An electroless copper-plating solution comprising a source of cupric ions, hydroxyl radicals, formaldehyde or a formaldehyde precursor preferably paraformaldehyde and a complexing agent for copper; said solution characterized by the addition of a member selected from the group consisting of a formaldehyde addition agent, a solution soluble salt of a Group VIII metal of the Periodic Chart of the elements, preferably a combination thereof and most preferably, the two in combination with an organic silicon compound. The copper plate deposited from the preferred solution is alloyed with the Group VIII metal cation and is distinguishable from prior art electroless copper deposits by substantially improved bending or tensile properties and a smoother, more highly reflecting surface appearance. The electroless copper-plating solution is capable of providing a rapid rate of copper deposition dependent upon the selection of the complexing agent and the stability of its chelate with copper without sacrifice in tensile or bending properties of the copper deposit. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5256441-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5258200-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005067297-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4167601-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004226407-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4720404-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4228213-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6585811-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3765936-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9153449-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5269838-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5077099-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5810913-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5429861-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6398855-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4265943-A |
| priorityDate |
1968-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |