http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3615733-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3af3390937c06df72b00e23a42cf63ef |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate | 1968-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1971-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b4207c852c3c63530f8ae107f735418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9bc6d1c4e0b6c77b915df2f41b8c418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4008aaaf18728996e63c4dedc41a79e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e59d4f68e74df607db514f2fbb24e8ec |
| publicationDate | 1971-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-3615733-A |
| titleOfInvention | Electroless copper plating |
| abstract | An electroless copper plating solution comprising a source of cupric ions, hydroxyl radicals, formaldehyde or a formaldehyde precursor, preferably paraformaldehyde, and a complexing agent for copper; said solution characterized by the addition of a combination of additives comprising an organic silicon compound and a hydrogen inclusion retarding agent and preferably, the combination of the two with at least one member selected from the group consisting of a formaldehyde addition agent and a Group VIII metal salt of the Periodic Chart of the Elements. Copper plate deposited from a solution of this invention is distinguishable from prior art copper deposits by substantially improved bending or tensile properties and a smoother, more highly reflecting appearance. The electroless copper plating solution is capable of providing a rapid rate of copper deposition dependent upon the selection of the complexing agent and the stability of its chelate with copper without sacrifice in tensile or bending properties of the copper deposit. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4563217-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4143186-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10218077-B4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109898074-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5616422-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6743479-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5221328-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4525390-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4138267-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4265943-A |
| priorityDate | 1968-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 133.