| abstract |
Active components, such as logic gates or flip-flops, formed in a semiconductor substrate are interconnected to input/output bonding pads and other active components in a circuit array in four separate operations. First, after arranging the active components in rows, signal points of all components in one row are interconnected by considering the longest interconnection and proceeding to the shortest. Next, component signal points between rows are interconnected again by considering the longest interconnecting path and proceeding to the shortest path. Third, input/output component signal points are assigned to input/output conductive pads. Finally, interconnecting paths are completed between the input/output component signal points and an assigned pad in a numbered order. Each operation uses a distinct algorithm to complete the necessary steps. |