| abstract |
A BATH AND PROCESS FOR THE ELECTROLESS (CHEMICAL) PLATING OF NICKEL, COBALT, IRON AND CHROMIUM ON OTHER MATERIALS SUCH AS METALS AND PLASTICS. THE BATH UTILIZES A REDUCING AGENT TO WHICH IS ADDED A NICKEL, COBALT, IRON OR CHROMIUM COORDINATION COMPOUND AS THE SOURCE OF THE PLATING METAL. OTHER CONSTITUENTS ALSO NORMALLY ADDED TO THE BATH ARE COMPLEXING AGENTS AND BUFFERING AGENTS. UTILIZATION OF METAL-COORDINATION COMPOUNDS AS THE STARTING PLATING MATERIAL SOURCE GREATLY ENHANCES THE OPERATING CHARACTERISTICS OF THE BATH AND MAKES POSSIBLE THE PLATING OF MATERIALS HERETOFORE NOT SUSCEPTIBLE TO ELETROLESS PLATING. |