| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd8dff0cc6d024e095d5decaf9202f49 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
1963-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1967-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d10415164cf7328b65e52d13efd3ce5f |
| publicationDate |
1967-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-3307972-A |
| titleOfInvention |
Electroless copper deposition |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3034890-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004108199-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8268189-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008207841-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3527579-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4820549-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5965211-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4576689-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4674235-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3415666-A |
| priorityDate |
1963-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |