| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7912cf53cffba0eab4f4d7816adb7013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-40 |
| filingDate |
1957-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1959-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d88b40c909cd3afb70ae8d8b6b0032ef |
| publicationDate |
1959-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2916423-A |
| titleOfInvention |
Electrodeposition of copper and copper alloys |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0636713-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3356579-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3108006-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006123985-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005269708-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015039152-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3930965-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5534129-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1874982-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0636713-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1874982-A1 |
| priorityDate |
1957-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |