| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_78f2deeadf8c213c9ef1eca9f91348c9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 |
| filingDate |
1956-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1959-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e9aff103fc157a1629830475c397868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_307056ceb9f3c290651c21e8cd641261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a517beeccb5db01e8f4f45e908dd0874 |
| publicationDate |
1959-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2886500-A |
| titleOfInvention |
Electroplating of copper alloys |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0163419-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3505184-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4364804-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3440151-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3775268-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2478133-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0163419-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015039152-A1 |
| priorityDate |
1956-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |